|
Capability |
|
|
Layer Counts |
2--38 |
|
Material |
FR4, High Tg, Halogen Free, Metal Base, Rogers, Ceramic |
|
Maximum Size |
20x42"(610x1100mm) |
|
Board Outline Tolerance |
±4mil(0.10mm) |
|
Board Thickness |
4-240mil(0.10-6.00mm) |
|
Thickness Tolerance( T≥0.8mm) |
±10% |
|
Thickness Tolerance( T<0.8mm) |
±4mil(0.1mm) |
|
Insulation Layer Thickness |
4-240mil(0.10-6.00mm) |
|
Minimum Line/space |
2.8/2.8mil(0.071/0.071mm) |
|
Outer Layer Copper Thickness |
H-6OZ(17-210um) |
|
Inner Layer Copper Thickness |
H-5OZ(17-175um) |
|
Thick Gold |
1-70U"(0.0254-1.8um) |
|
Finish Hole (Mechanical) |
8-252mil(0.20-6.30mm) |
|
Registration (Mechanical) |
3mil(0.075mm) |
|
Diameter Tolerance (Mechanical) |
2mil(0.05mm) |
|
Laser Hole |
3mil(0.076mm) |
|
HDI Capability |
3+N+3 |
|
Aspect Ratio |
14:1 |
|
SMT Mini. Solder Mask Dam |
3mil(0.076mm) |
|
Impedance Control Tolerance |
±5-10% |
|
Surface Finish |
HASL, OSP, Immersion Silver, Immersion Gold, Flash Gold, Selective hard Gold, |
